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Director of Semiconductor Packaging
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Director of Semiconductor Packaging
A growing semiconductor client is currently seeking a Director of Semiconductor Packaging to lead the development of advanced, high-performance packaging solutions for GaN power semiconductors.
The role combines technical leadership, people leadership, and hands-on engineering. The successful candidate will set the packaging strategy, build team capability, influence company-wide decisions, and work closely with internal teams and external packaging/manufacturing partners.
Key Responsibilities
- Lead the design and development of high-performance, high-density semiconductor packages for GaN power products.
- Develop technologies including wirebond, flip-chip, embedded packaging, and wafer back-end processes.
- Balance electrical, thermal, mechanical, cost, quality, and form-factor requirements.
- Lead packaging development with overseas assembly houses and technology suppliers.
- Support package verification, qualification, reliability, and thermal testing.
- Drive design-for-manufacture, design processes, and engineering tools to achieve right-first-time designs.
- Conduct first-article inspection and failure analysis.
- Provide packaging expertise to Applications Engineering and customers.
- Contribute significantly to the product and technology roadmap.
- Build external networks and maintain awareness of state-of-the-art semiconductor packaging.
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Essential Experience & Skills
- Degree or higher in Engineering, Physics, Materials Science, or a related discipline.
- Strong experience designing and manufacturing high-volume semiconductor power packages, including working with overseas assembly houses.
- Deep knowledge of packaging technologies including:
- Die attach / Ag-sintering
- Flip-chip
- Wire bonding
- Copper clip
- PCB embedding
- Chip metallisation
- Strong 3D CAD experience and knowledge of supplier design rules/DFM.
- Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS, or equivalent.
- Experience with thermal characterisation of semiconductor packages.
- Experience with package qualification/reliability testing, including TCoB, MSL, TC, HAST, and HTS, against relevant standards.
- Strong cross-functional leadership and supplier-management skills.
- Ability to manage priorities independently and deliver results.
- Confident presenting technical results to internal and external stakeholders.
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