Huawei R&D UK
Engineering Team Lead - Deposition and Etch

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Job Summary
The Team Leader oversees daily team operations, talent development, and strategic execution to drive core business objectives within the deposition and etch cell.
Team Leadership & Development
- Guide daily operations
- Mentor team members
- Foster professional growth
Operational Execution
- Ensure high-quality, on-time delivery of team deliverables and project milestones
Process Optimization
- Drive continuous improvement initiatives to enhance efficiency and workflows
Strategic Collaboration
- Partner with cross-functional stakeholders to align team goals with broader business strategy
Responsibility
Team Leadership & People Management
- Direct Team Oversight
- Lead, mentor, and develop a team of process engineers, technicians, and cleanroom associates focused on deposition and etch operations within a high-specification semiconductor cleanroom.
- Goal & Performance Alignment
- Set clear, measurable KPIs and deliverables aligned with customer milestones, conducting robust performance reviews and coaching to build operational resilience across multiple concurrent projects.
- Capability & Skills Development
- Own the cell’s technical training and skills matrix to ensure sustained engineering capacity, adaptability, and career progression.
- Culture & Collaboration
- Champion core behavioural standards, fostering an inclusive, high-collaboration, and innovative culture across cross-functional engineering and manufacturing teams.
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Technical Execution & Process Engineering
- Advanced Cell Operations
- Oversee process development and baseline stability for deposition and etch modules, specializing in precision III-V semiconductor materials.
- Tool & Recipe Development
- Direct recipe development, optimization, and failure analysis utilizing RIE, ICP-RIE, PECVD, ALD, SEM, and FIB-SEM platforms.
- New Equipment & Technology Integration
- Lead the qualification, installation, and baselining of new capital equipment and advanced process technologies alongside comprehensive standard operating documentation.
Quality, Data & Continuous Improvement
- Quality-First Framework
- Embed a "quality first" standard across all product lifecycle stages, enforcing rigorous cleanroom safety protocols, change control, and Out-of-Control Action Plans (OCAPs).
- Data-Driven Engineering
- Drive empirical decision-making across the team using Design of Experiments (DoE), Statistical Process Control (SPC), Gauge R&R, and advanced statistical analysis (e.g., Minitab).
- Structured Problem Solving
- Facilitate rapid root cause analysis and resolution for complex yield and reliability issues using 8D, pFMEA, and mFMEA frameworks.


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Strategy & Stakeholder Coordination
- Strategic Roadmap Alignment
- Align deposition and etch cell capabilities with the overarching business goals, yield targets, and the long-term technical roadmap.
- Stakeholder Coordination
- Partner with module leads, integration engineers, operations, and quality stakeholders to standardize best practices and scale technical innovations reliably across the fab.
Requirements
- Bachelor’s/Master’s/PhD in Materials Science, Physics, Semiconductor Technology, Engineering, or related field.
- 5+ years of semiconductor process engineering experience in a high-specification cleanroom.
- 3+ years of technical team leadership/mentoring experience, including KPI and skills management.
- Strong experience with III-V materials (InP, GaAs, GaN) and semiconductor etch/deposition processes, including RIE, ICP-RIE, PECVD, and ALD.
- Hands-on experience with SEM/FIB-SEM for process and failure analysis.
- Proven experience in process development, optimization, transfer, and equipment qualification/commissioning.
- Strong knowledge of DoE, SPC, MSA/Gauge R&R, and quality tools such as 8D, FMEA, QCP, and OCAP.
- Strong analytical, communication, problem-solving, and cross-functional collaboration skills; able to work independently and under pressure.
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