Our team of 100+ is based across London, Oxford, San Sebastián and Sydney, with our primary hub in Islington (London).

Functions of the Role

We’re looking for a visionary and hands-on 3D Integration and Advanced Packaging lead to bridge the gap between cutting-edge silicon spin qubit devices and scalable quantum systems.

In this role, you will build and lead a team to drive the R&D of complex, multi-chip modules utilising TSVs and microbumps, optimised to operate at millikelvin temperatures. This is a rare and exciting opportunity to solve the industry’s toughest interconnect bottlenecks and shape the physical architecture of next-generation quantum processors.

• Recruit, mentor, and lead a high-performing team of packaging, signal integrity, materials, and quantum integration engineers.
• Drive the strategy, design, and rapid prototyping of 3D integrated circuits and multi-chip quantum modules.
• Ensure all packaging architectures and interconnects can withstand thermal cycling down to millikelvin regimes without delamination or performance degradation.
• Own relevant operations with external foundries, OSATs, and research partners. Seamlessly transfer novel packaging designs to external manufacturing lines.
• Serve as the critical link between design, process integration, cryo R&D, and quantum hardware teams to co-optimise the electrical, thermal, and mechanical design.
• Balance rapid R&D prototyping with a rigorous, parallel focus on yield improvement, failure analysis, and long-term reliability.

Experience - Essentials

• Master’s or PhD in electrical engineering, materials science, physics, microelectronics, or related field.
• 7+ years deep technical experience in 3D integration, specifically with TSVs, fine-pitch microbumps, flip-chip bonding, and/or multi-chip modules.
• Proven track record or building, scaling, and managing engineering teams in high-tech, fast-paced environments.
• Strong experience managing technical transfers and working closely with external semiconductor foundries or advanced packaging facilities.

Experience - Desirable

• Proficiency with industry-standard simulation tools (e.g., Ansys HFSS/Q3D, Cadence) to model signal integrity, thermal stress, and mechanical behaviour.
• Direct experience with cryogenic electronics.
• Background or strong familiarity with solid-state quantum mechanics, silicon spin qubits, or semiconductor physics.
• Knowledge of materials behaviour (superconductors, low loss dielectrics) at extreme temperatures.

Benefits

• Be part of a creative, world-leading team
• Competitive salary and share options scheme
• Contributory pension scheme
• Group private medical insurance scheme
• Life Assurance
• Cycle-to-work Scheme
• Central London location

EEO Statement

Quantum Motion is committed to providing equal employment opportunity and does not discriminate based on age, sex, sexual orientation, gender identity, race, colour, religion, disability status, marital status, pregnancy, gender reassignment or any other protected characteristics covered by the Equality Act 2010.

About us

Quantum Motion is a fast-growing quantum computing scale-up based in London founded by internationally renowned researchers from UCL and Oxford University with over 40 years’ experience in developing qubits and quantum computing architectures. Bringing together state-of-the-art cryogenic facilities and an outstanding interdisciplinary team, we are developing quantum processors based on industrial-grade silicon chips, with the potential to radically transform computing power in areas such as materials modelling, medicine, artificial intelligence and more.