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Mixed Signals Electronics Engineer - Compute

Oxford
Posted 1 day ago
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Job Type: Permanent

Work Location: Hybrid

Posted: 5 Oct 2026 (Today)


Mixed Signal Electronics Engineer

Infleqtion is a global quantum technology company solving the world’s most challenging problems. The company harnesses quantum mechanics to build and integrate quantum computers, sensors, and networks. From fundamental physics to leading edge commercial products, Infleqtion enables “quantum everywhere” through our ecosystem of devices and platforms.

We are recruiting for a Mixed Signal Electronics Engineer.

Location

Infleqtion has 6 office locations, operating out of Austin, TX; Boulder/Louisville, CO; Madison, WI; Chicago, IL; Oxford, UK; and Melbourne, AU. This position is a full-time, hybrid position which will be located in our Oxford, United Kingdom office.

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Infleqtion UK is looking for a mixed signal electronics engineer with a passion for working with a multi-disciplinary team to bring state-of-the art quantum technologies outside the laboratory and into the real-world. You will use your skills to contribute to the design, verification, and implementation of electronic systems and subsystems for Infleqtion’s quantum products. You will have strong skills and relevant experience working with digital, mixed-signal, and analogue electronics, ranging from DC to RF frequencies.

Job Responsibilities

The duties and responsibilities outlined below include essential functions of the role. Depending on business needs, this role may perform a combination of some or all of the following duties. Duties, responsibilities, and activities may change, or new ones may be assigned at any time with or without notice.

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  • Translating product requirements into end-to-end signal chain architecture
  • Execution of modelling, simulation, and analytical calculations to design systems required to meet product performance
  • Digital and mixed signal circuit design and signal processing using components such as DAC/ADC, FPGA's.
  • PCB design and layout for integration into larger mechanical, optical, and other subsystems
  • Shielding, cabling, and routing design for RF isolation
  • Generation of files suitable for PCB manufacture
  • Design and execution of test plans
  • Identifying and engaging key suppliers
  • Supporting development of risk management plans and risk resolution, and supporting reliability analysis and continuous improvement.
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Location

Oxford, England, United Kingdom

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