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microTECH Global LTD

Packaging Engineer

Manchester
Posted about 12 hours ago
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MEMS Assembly & Packaging Engineer

Location: Manchester, UK (On-site)
Salary: Competitive

An exciting opportunity has arisen for a hands-on MEMS Manufacturing Engineer to join an innovative deep-tech company developing next-generation MEMS sensing technology.

This role will be instrumental in taking advanced MEMS devices from prototype development through to pilot-scale manufacturing. Working closely with multidisciplinary engineering teams, you will develop assembly processes, optimise manufacturing workflows, improve yields, and support the transition from R&D into scalable production.

Key Responsibilities:

  • Build and assemble MEMS-based prototype devices and subsystems.
  • Develop and optimise manufacturing and assembly processes.
  • Perform and improve die attach, wire bonding, packaging and precision assembly activities.
  • Design and implement tooling, fixtures, jigs and assembly aids.
  • Troubleshoot manufacturing, reliability and yield issues.
  • Drive Design for Manufacture (DfM) and Design for Assembly (DfA) improvements.
  • Create manufacturing documentation, SOPs and work instructions.
  • Support New Product Introduction (NPI) and manufacturing scale-up activities.
  • Work with external manufacturing, foundry and packaging partners as production grows.

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Graduate Consultant — 2026 Scheme

PwC·London, UK
£35,000/yr

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Your economics background and your summer at a regional bank line up with what PwC looks for on the consulting scheme. Applications close in four weeks.

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Why you're a good match

You’ve got the grades and the economics background, and your bank internship is exactly the experience this scheme looks for. Apply soon — deadlines close within the month.

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Requirements:

  • Degree in Engineering, Physics, Materials Science or a related discipline.
  • 3+ years' experience within semiconductor, MEMS, photonics or advanced technology manufacturing.
  • Experience with semiconductor packaging, die attach, wire bonding or precision assembly processes.
  • Strong process development and problem-solving skills.
  • Experience developing manufacturing procedures and documentation.
  • Comfortable working in a fast-paced, hands-on engineering environment.
  • Cleanroom manufacturing environments.
  • CAD design for fixtures and tooling.
  • Reliability testing and failure analysis.
  • Statistical Process Control (SPC).
  • Wafer-level or advanced semiconductor packaging.
  • Working with foundries, OSATs or contract manufacturers.

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Location

Manchester, England, United Kingdom

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