IC Resources
Principal Packaging Engineer

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My client is looking for a Principal Packaging Engineer, focused on advanced packaging architecture, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. This is an opportunity for an Engineer with a strong technical background, and leadership experience, looking to step into a Principal position.
Responsibilities
- Architect advanced 2.5D/3D packaging and heterogeneous integration solutions
- Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development
- Take packaging concepts from customer requirements through prototyping, demonstrators and qualification
- Define packaging technology roadmaps and drive long-term innovation
- Lead multidisciplinary technical projects across design, assembly, thermal and test
- Develop advanced microelectronic modules and system demonstrators
- Provide technical leadership across design, validation and qualification
- Support hands-on prototyping and laboratory development
- Contribute to technical proposals, bids and collaborative R&D programmes
- Manage technical risks and support technology decisions with customers and partners
Reasons to use Rodeo
I’m in my final year doing Economics and I don’t know whether to apply for grad schemes now or do a masters first. What do you think?
Honest answer — it depends on where you want to end up. A lot of top grad schemes (Big 4, civil service, banking) don’t need a masters. Let’s look at the ones you’d be competitive for now, and we can decide if a masters actually adds anything.
Also worth knowing: most autumn 2026 applications are open now. Timing matters more than you think.
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Grad scheme, placement, apprenticeship? Not sure what you want yet — that's fine. Your agent talks it through with you and turns "I have no idea" into a shortlist.
Graduate Consultant — 2026 Scheme
Why you're a good match
StrongYour economics background and your summer at a regional bank line up with what PwC looks for on the consulting scheme. Applications close in four weeks.
See breakdownIt searches the market for you
Every day your agent scans the market matching roles against what actually matters to you, not just keywords on a CV.
Why you're a good match
You’ve got the grades and the economics background, and your bank internship is exactly the experience this scheme looks for. Apply soon — deadlines close within the month.
Experience fit
Your summer at the bank plus your econometrics coursework map directly to the day-one responsibilities on this scheme — client modelling, market briefings, and deal support.
Only hits
No noise. No "maybe this fits." Just roles with a clear explanation of why they're right — and where to focus when applying.
Requirements
- Strong experience in advanced semiconductor packaging and heterogeneous integration
- Expertise in 2.5D/3D packaging, chiplets and advanced assembly
- Experience with substrates, interposers, TSVs and/or hybrid bonding
- Proven experience leading semiconductor packaging development projects
- Understanding of the full packaging lifecycle from design through qualification
- Knowledge of signal integrity, power integrity and thermal management
- Experience taking R&D concepts through to working prototypes or demonstrators
- Strong technical leadership, problem-solving and communication skills
- Experience in AI, HPC, telecoms or photonics is desired but not a must


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Benefits
- Competitive salary + bonus
- Sponsorship + Relocation assistance
- Company pension
- Private healthcare for you and your family
- Hybrid working to fit around your schedule
- A healthy work environment, with great work life balance
If you are interested, contact Ella Flynn at IC Resources.
“It took my CV and asked me questions relevant to understanding what kind of jobs to suggest for me. Suggestions were almost perfect. Jobs were exactly what I’ve been looking for.”
Jessica, London
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