IC Resources
Process Engineer
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We’re supporting a long-standing client in the high-frequency electronics sector who is hiring a Process Engineer to support the scale-up of advanced RF and semiconductor assembly processes.
As Process Engineer, you’ll work on the development, optimisation and control of manufacturing processes used in microwave, millimetre-wave and RF module production. The role has a strong focus on die attach technologies, including silver epoxy, silver sinter and eutectic attach, as well as gold wire and ribbon bonding across a range of substrates and device materials.
You’ll work closely with RF engineering, quality, operations and manufacturing teams to transfer new technologies from development into stable, repeatable production. The focus will be on improving process robustness, yield, manufacturability and cost efficiency, while supporting NPI and future technology roadmap activity.
This role would suit someone who enjoys hands-on process engineering in a high-precision manufacturing environment, rather than a purely documentation-led position.
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What We’re Looking For
- Experience as a Process Engineer within semiconductor, RF module assembly, microelectronics, power electronics, hybrid assembly, advanced packaging or high-precision electronics manufacturing
- Practical experience with one or more die attach processes, such as silver epoxy, silver sintering or eutectic attach
- Exposure to gold wire bonding, ribbon bonding, ball bonding or wedge bonding
- Good understanding of process windows, including temperature, pressure, time and atmosphere, and how these impact yield and reliability
- Experience with process validation, qualification plans, control plans, SOPs or manufacturing process documentation
- Ability to investigate issues relating to voiding, bond line thickness, shear strength, bond integrity, thermal resistance or pad damage
- Familiarity with yield improvement, root cause analysis and structured problem-solving methods such as 8D, DMAIC or FMEA
- Degree or equivalent background in engineering, materials science, physics or a related technical discipline
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Experience with RF packaging requirements, SPC, Cp/Cpk, JEDEC standards, equipment commissioning, automation or material reliability testing would be useful, but is not essential.
Why consider this role?
The client is investing heavily in advanced packaging and assembly capability, and the Process Engineer will play a key role in taking new RF technologies into reliable, scalable production. You’ll work closely with both development and manufacturing teams, with real influence over how processes are built, validated and improved.
For more information, please contact Teddy Jones at IC Resources.
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