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Job Summary

As a Process Engineering Technician, you will join our Fab Engineering team to process semiconductor wafers and support Metal deposition and Wafer Thinning area in delivering robust, stable processes for ongoing R&D projects, Process Architects, and high-volume manufacturing.

This role is primarily cleanroom-based, involving hands-on operation and development across all equipment and processes within the Metal deposition and wafer Thinning area, with occasional support in adjacent process cells.

Working Pattern

• 2 Shifts Based, Rotating weekly
• Monday to Friday, Total 37.5 hours per week
  • Shift One: 07:00 – 15:00
  • Shift Two: 11:00 – 19:00

Key Responsibilities:

• Run day-to-day operations on metal deposition and wafer thinning equipment.
• Process R&D and manufacturing wafers following guidance from Engineers and Architects.
• Serve as the main contact between Cell Engineers and Maintenance team, providing hands-on support for preventive maintenance, chamber cleans, and tool upkeep.
• Manage SPC data collection by ensuring test materials are ready and routine checks are completed on time.
• Bridge communication between Manufacturing and Process Engineering when tool or process faults occur to keep downtime to a minimum.
• Help the team smoothly return tools and processes to production following maintenance or downtime.
• Coordinate with other areas of the fabs to ensure material entering and leaving the Metallization and Thinning area meets quality standards.
• Assist Process Engineers in drafting and updating practical documentation, including Standard Operation Procedure (SOP) and related documents.
• Drive recipe control by keeping process recipes accurate, updated, and ready for manufacturing use.
• Train operators on tools and process procedures whenever required.
• Support Process Engineers with process optimization, new process development, and tool commissioning.
• Actively participate in 7S and continuous improvement activities on the shop floor.
• Carry out additional ad-hoc engineering support tasks as requested by the team.

This job description is only an outline of the tasks, responsibilities and outcomes required of the role. The jobholder will carry out any other duties as may be reasonably required by his/her line manager. The job description and personal specification may be reviewed on an ongoing basis in accordance with the changing needs of Huawei Research and Development UK Limited.

Person Specification:

Required:

• Good manual dexterity for handling semiconductor wafers and samples.
• Science based education background or relevant previous experience in Cleanroom or Lab environments.
• Knowledge and experience of SPC processes and six sigma techniques.
• Working knowledge of MES and general office and data software – eg, MS Word, Excel.

Desired:

• Minimum of 1 year’s hands-on Fab experience in the following processes – metal deposition (PVD, sputtering and electroplating), etching and mechanical thinning of wafers.
• Experience in running experiments in a scientific environment, collating and presenting results.
• Good working knowledge of semiconductor materials and processes.

Personal Attributes:

• Able to work under pressure to meet tight deadlines – level headed, calm and considered.
• Proactive team player who is also capable of working independently.
• Positive attitude in working & learning and actively seeks to share ideas and information with colleagues.
• Attention to details.
• Proven ability to work under own initiative, and to seek advice when required.
• Good communication and interpersonal skills.
• Flexible approach to working – work the hours to do the job.
• Supportive of the company culture and ethos.