Clarion Chase
Senior Process Engineer, Back-End-of-Line
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Job Opportunity: Process Engineer in Power Semiconductor and Electronics
We are exclusively representing one of the leading-edge power semiconductor and electronics industry powerhouses by assisting them in expanding their process engineering capacity at their headquarters.
The business is an IDM of power devices that go into Rail, Industrial, Renewables, HVDC, and Automotive applications globally.
They manufacture devices covering Silicon, Silicon Carbide, and Gallium Nitride mainly; these are the primary materials the position will be responsible for bonding/attaching to the power modules.
Responsibilities
- Develop, optimise and industrialise joining and interconnection processes, including soldering, sintering, brazing, bonding, and other advanced attachment technologies.
- Research, evaluate, and select materials including solders, sinter materials, metals, ceramics, polymers, adhesives, silicone gels, and other functional materials.
- Investigate material and process-related problems using structured root-cause analysis, failure analysis, and Design of Experiments (DoE) techniques.
- Characterise materials and process outputs using appropriate physical, chemical, mechanical, thermal, electrical, and microstructural analysis techniques.
- Develop methods for evaluating bond strength, interfacial integrity, material degradation, and reliability.
- Define appropriate test methods and acceptance criteria in line with relevant ISO, ASTM, and internal standards.
- Provide technical input into the design and development of next-generation power modules, considering thermal management, electrical isolation, mechanical stresses, reliability, and manufacturability.
- Support the transfer of laboratory-developed processes into prototype and production environments.
- Work with external suppliers, material manufacturers, universities, and research organisations to develop and qualify new materials and technologies.
- Prepare technical reports, specifications, presentations, risk assessments, and process documentation, communicating complex technical information clearly to a range of audiences.
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Required Skillset
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- A degree in Materials Science, Materials Engineering, Metallurgy, Mechanical Engineering, Electrical/Electronic Engineering, Physics, or a related scientific or engineering discipline.
- Strong experience in experimental planning, process trials, data analysis, and interpretation.
- Experience of root-cause analysis, failure investigation, and structured technical problem-solving.
- Good knowledge of materials characterisation and analytical techniques, including microscopy, spectroscopy, thermal analysis, mechanical testing, or surface/interface analysis.
- A strong understanding of material interfaces, bonding mechanisms, and the behaviour of dissimilar materials.
- Preferred: IGBT, SiC, or other high-power semiconductor module packaging.
- Experience in die attach, substrate attach, power interconnects, encapsulation, or electrical insulation systems.
- Knowledge of pressure-assisted or pressure-less silver or copper sintering.
- Understanding of high-temperature and high-reliability materials and processes.
- Knowledge of thermo-mechanical behaviour, coefficient of thermal expansion (CTE), thermal conductivity, residual stress, warpage, and fatigue in electronic packages.
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