Tenstorrent
Chiplet Design Architect
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Tenstorrent Overview
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
Role Overview
As a CPU Chiplet Architect at Tenstorrent, you will define the architecture for next-generation chiplet-based compute platforms, enabling high-performance RISC-V CPUs within scalable System-in-Package (SiP) solutions. You will own key platform subsystems—including PCIe, die-to-die connectivity, system management, and confidential computing—and work closely with architecture, hardware, software, and external IP partners to deliver robust, production-ready chiplet architectures.
This role is remote, based out of The United States.
We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Who You Are
- An experienced SoC or chiplet architect with a passion for defining scalable platform architectures.
- A collaborative technical leader who can build alignment across architecture, hardware, software, and external partners.
- Comfortable making architectural decisions in complex, fast-moving environments with evolving requirements.
- A proactive learner who enjoys mastering new technologies across hardware, firmware, and system software.
- An excellent communicator who can clearly articulate architectural trade-offs and drive execution.
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What We Need
- Bachelor's, Master's, or Ph.D. in Computer Engineering, Electrical Engineering, Computer Science, or a related field.
- 10+ years of experience in SoC, CPU, or chiplet architecture for high-performance computing or server-class systems.
- Strong expertise in PCI Express Root Complex, RCiEP, coherent fabrics (including CHI-C2C), IOMMU, ATS/PRI, MSI, CXL.mem, and confidential computing technologies such as TEE-I/O.
- Deep understanding of system management, including boot, reset, debug, and power management for high-performance CPUs.
- Proven ability to lead cross-functional architecture efforts, influence technical direction, and communicate effectively across engineering organizations.
What You Will Learn
- How next-generation chiplet-based AI and CPU platforms are architected and integrated into scalable systems.
- Advanced techniques for confidential computing, coherent fabrics, PCIe, and die-to-die communication in high-performance compute systems.
- How hardware, firmware, operating systems, and virtualization technologies come together to enable modern server platforms.
- Best practices for integrating third-party IP into complex SoCs while maintaining performance, security, and reliability.
- How Tenstorrent develops industry-leading RISC-V platforms through close collaboration across global engineering teams.
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Compensation
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.
Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.
Note: This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.
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