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Senior Packaging Engineer

London
£130k – £150k/yr
Posted about 15 hours ago
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Senior / Staff Packaging Engineer

London (Hybrid)

My client is an innovative AI hardware startup developing next-generation computing technology designed to revolutionise AI infrastructure. They're looking for an experienced Packaging Engineer to help bridge the gap between cutting-edge silicon and high-performance products, working on advanced semiconductor technologies alongside a world-class engineering team.

Role Requirements:

  • Lead the development of advanced semiconductor packaging solutions from concept through to production
  • Design and optimise package, substrate and system-level integration for high-performance devices
  • Work across package architecture, layout, simulation and product development activities
  • Collaborate with ASIC, hardware and systems engineers to deliver innovative packaging solutions

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I’m in my final year doing Economics and I don’t know whether to apply for grad schemes now or do a masters first. What do you think?

Honest answer — it depends on where you want to end up. A lot of top grad schemes (Big 4, civil service, banking) don’t need a masters. Let’s look at the ones you’d be competitive for now, and we can decide if a masters actually adds anything.

Also worth knowing: most autumn 2026 applications are open now. Timing matters more than you think.

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Graduate Consultant — 2026 Scheme

PwC·London, UK
£35,000/yr

Why you're a good match

Strong

Your economics background and your summer at a regional bank line up with what PwC looks for on the consulting scheme. Applications close in four weeks.

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Why you're a good match

You’ve got the grades and the economics background, and your bank internship is exactly the experience this scheme looks for. Apply soon — deadlines close within the month.

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Experience fit

Your summer at the bank plus your econometrics coursework map directly to the day-one responsibilities on this scheme — client modelling, market briefings, and deal support.

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Key Skills Required:

  • Experience in semiconductor packaging or advanced electronic packaging
  • Knowledge of package, substrate or PCB design and integration
  • Experience using industry-standard package or PCB design tools
  • Understanding of signal integrity, power integrity or high-speed design principles
  • Experience working with multidisciplinary engineering teams throughout product development

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If this sounds like you, please apply, or send a copy of your CV to holly@platform-recruitment.com and I will be in touch!

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Skills

Semiconductor Packaging
Electronic Packaging
Package Design
Substrate Design
PCB Design
Signal Integrity
Power Integrity
High-Speed Design
Multidisciplinary Engineering

Location

London, England, United Kingdom

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