Platform Recruitment
Senior Packaging Engineer

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Senior / Staff Packaging Engineer
London (Hybrid)
My client is an innovative AI hardware startup developing next-generation computing technology designed to revolutionise AI infrastructure. They're looking for an experienced Packaging Engineer to help bridge the gap between cutting-edge silicon and high-performance products, working on advanced semiconductor technologies alongside a world-class engineering team.
Role Requirements:
- Lead the development of advanced semiconductor packaging solutions from concept through to production
- Design and optimise package, substrate and system-level integration for high-performance devices
- Work across package architecture, layout, simulation and product development activities
- Collaborate with ASIC, hardware and systems engineers to deliver innovative packaging solutions
Reasons to use Rodeo
I’m in my final year doing Economics and I don’t know whether to apply for grad schemes now or do a masters first. What do you think?
Honest answer — it depends on where you want to end up. A lot of top grad schemes (Big 4, civil service, banking) don’t need a masters. Let’s look at the ones you’d be competitive for now, and we can decide if a masters actually adds anything.
Also worth knowing: most autumn 2026 applications are open now. Timing matters more than you think.
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Grad scheme, placement, apprenticeship? Not sure what you want yet — that's fine. Your agent talks it through with you and turns "I have no idea" into a shortlist.
Graduate Consultant — 2026 Scheme
Why you're a good match
StrongYour economics background and your summer at a regional bank line up with what PwC looks for on the consulting scheme. Applications close in four weeks.
See breakdownIt searches the market for you
Every day your agent scans the market matching roles against what actually matters to you, not just keywords on a CV.
Why you're a good match
You’ve got the grades and the economics background, and your bank internship is exactly the experience this scheme looks for. Apply soon — deadlines close within the month.
Experience fit
Your summer at the bank plus your econometrics coursework map directly to the day-one responsibilities on this scheme — client modelling, market briefings, and deal support.
Only hits
No noise. No "maybe this fits." Just roles with a clear explanation of why they're right — and where to focus when applying.
Key Skills Required:
- Experience in semiconductor packaging or advanced electronic packaging
- Knowledge of package, substrate or PCB design and integration
- Experience using industry-standard package or PCB design tools
- Understanding of signal integrity, power integrity or high-speed design principles
- Experience working with multidisciplinary engineering teams throughout product development


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If this sounds like you, please apply, or send a copy of your CV to holly@platform-recruitment.com and I will be in touch!
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