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Fractile

Senior/Principal Physical Design Engineer

London
Posted 3 days ago
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Fractile’s Mission

Fractile’s mission is to enable a new chapter in the AI revolution. We’re pioneering AI innovation where hardware and software join to create something extraordinary, unlocking the power of the world’s largest language models with speed increases of x100. Our team is rapidly expanding, and we're searching for visionary engineers, scientists, and thinkers who share our passion for pushing boundaries and redefining what's possible. If you're ready to join a dynamic group of innovators shaping AI's future, we want to hear from you!

Role Description

We are seeking a highly skilled Senior/Principal Physical Design Engineer to contribute to our next-generation chip designs. As a Physical Design Engineer, you will be responsible for the end-to-end implementation of complex IC physical designs, from synthesis to sign-off, including opportunities for full-chip ownership. You will collaborate with cross-functional teams, including logic design, verification, and process technology, to optimise performance, power, and area (PPA) while ensuring design integrity and manufacturability.

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I’m in my final year doing Economics and I don’t know whether to apply for grad schemes now or do a masters first. What do you think?

Honest answer — it depends on where you want to end up. A lot of top grad schemes (Big 4, civil service, banking) don’t need a masters. Let’s look at the ones you’d be competitive for now, and we can decide if a masters actually adds anything.

Also worth knowing: most autumn 2026 applications are open now. Timing matters more than you think.

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Graduate Consultant — 2026 Scheme

PwC·London, UK
£35,000/yr

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Your economics background and your summer at a regional bank line up with what PwC looks for on the consulting scheme. Applications close in four weeks.

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You’ve got the grades and the economics background, and your bank internship is exactly the experience this scheme looks for. Apply soon — deadlines close within the month.

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Your summer at the bank plus your econometrics coursework map directly to the day-one responsibilities on this scheme — client modelling, market briefings, and deal support.

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Key Responsibilities

  • Drive the physical implementation of ASIC/SoC designs, including floorplanning, placement, clock tree synthesis (CTS), routing, and sign-off, with potential responsibility for full-chip execution.
  • Work on synthesis, timing analysis (STA), and optimisation to achieve the best PPA metrics.
  • Perform power planning and analysis, addressing IR drop, electromigration, and low-power design techniques.
  • Ensure design rule check (DRC), layout vs. schematic (LVS), and other physical verification compliance.
  • Collaborate with DFT engineers to integrate design-for-test (DFT) structures into the physical implementation.
  • Develop flows in EDA tools such as Cadence Innovus, Synopsys Fusion Compiler, Mentor Graphics Calibre, and others.
  • Interface with foundries and process engineers to ensure manufacturability and yield optimisation.
  • Work closely with RTL and architecture teams to drive design feasibility, constraints, and physical-aware RTL design.
  • Work with advanced AI tools and models to improve productivity, analysis, and design quality.

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Preferred Qualifications

  • Bachelor’s/Master’s or PhD in Electrical Engineering, Computer Engineering, or a related field.
  • 7+ years of experience in physical design for advanced technology nodes (e.g., 7nm, 5nm, or below).
  • Strong proficiency in EDA tools for place & route, STA, and sign-off.
  • Solid understanding of CMOS technology, semiconductor physics, and process limitations.
  • Experience with low-power design methodologies, power optimisation techniques, and multi-power domain architectures.
  • Expertise in timing closure, signal integrity, IR drop analysis, and formal verification.
  • Proficiency in scripting languages like TCL, Perl, or Python for automation.
  • Excellent problem-solving skills, communication, and teamwork in a collaborative design environment.
  • Experience in high-performance computing (HPC), AI accelerators, or networking chips.
  • Experience or strong interest in leveraging advanced AI tools and models within engineering workflows.
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Skills

Physical Design
ASIC Design
SoC Design
Timing Analysis
Power Planning
Low-Power Design
Design Rule Check
Layout vs. Schematic
Design-for-Test
EDA Tools
Scripting
Problem-Solving
Communication
Teamwork
AI Tools
High-Performance Computing

Location

London, England, United Kingdom

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