The Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) OTA
Very High Density Interconnects
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Very High Density Interconnects
This project will seek proposals for the development of prototype processes and materials for the manufacture of very high density substrate, interposer and redistribution layer electronic device packaging interconnect products using polymer based substrate materials.
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PROJECT TIMELINE
- Solutions Due: June 14, 2019 12:00 pm
- Award Notice: August 27, 2019 12:00 am
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